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New material resistant to high temperature and extreme resistance----aluminum nitride

2018-08-31
Aluminum nitride (AIN) crystals have a tetrahedral structural unit covalent bond compound and have a wurtzite structure and belong to a hexagonal system. White or off-white, single crystal is colorless and transparent, and the sublimation decomposition temperature under normal pressure is 2450 °C. It is a high temperature heat resistant material. Thermal expansion coefficient (4.0-6.0) X10-6/°C. Polycrystalline AIN has a thermal conductivity of 260 W/(m.k), which is 5-8 times higher than alumina, so it has good thermal shock resistance and can withstand extreme heat of 2200 °C. In addition, aluminum nitride is not attacked by aluminum liquid and other molten metals and gallium arsenide, and particularly has excellent corrosion resistance to molten aluminum liquid.

Due to the excellent physicochemical properties of AlN, the application is extremely extensive:

1. Aluminum nitride powder has high purity, small particle size and high activity, and is the main raw material for manufacturing high thermal conductivity aluminum nitride ceramic substrate.
2.Aluminum nitride ceramic substrate, high thermal conductivity, low expansion coefficient, high strength, high temperature resistance, chemical corrosion resistance, high resistivity, small dielectric loss, is an ideal large-scale integrated circuit heat sink substrate and packaging materials.
3. Aluminum nitride has high hardness and exceeds traditional alumina. It is a new type of wear-resistant ceramic material, but it can only be used for severely worn parts due to its high cost.
4. Using AIN ceramics for heat resistance, melt erosion and thermal shock resistance, GaAs crystal crucible, Al evaporating dish, magnetic fluid power generation device and high temperature turbine corrosion resistant parts can be fabricated, and its optical properties can be used as an infrared window. The aluminum nitride film can be made into a high frequency piezoelectric element, a very large scale integrated circuit substrate, or the like.
5. aluminum nitride heat-resistant, resistant to molten metal erosion, stable to acid, but easy to be eroded in alkaline solution. The AIN fresh surface is exposed to moist air and reacts to form a very thin oxide film. By utilizing this property, it can be used as a crucible and a die-casting mold material for smelting metals such as aluminum, copper, silver, and lead. AIN ceramics have good metallization properties and can be widely used in the electronics industry as an alternative to toxic cerium oxide.