Products

Nano Materials

Micro Material

Lubricating Material

Wear Resistant

Common Chemical

Bio Products

Dispersion

Telluride

wafer butterfly valve

AlN 65-75nm, 500/800nm 99.5% Hexagonal

AlN 65-75nm, 500/800nm 99.5% Hexagonal

AlN 65-75nm, 500/800nm 99.5% Hexagonal

Detailed
Aluminum Nitride Nanopowder (AlN, hexagonal) 65-75nm
Purity: 99.5%
APS: 65-75 nm
SSA: 40-80 m2/g
Color: gray
Zeta Potential: 44.7mV
Bulk Density: 0.05g/cm3
Thermal conductivity value 320w/mk
Thermal expansion coefficient: 3.5 × 10-6K-1

Aluminum Nitride Nanoparticles (AlN) Certificate of Analysis--%
N O C Fe Si Ca Cl
>33 <0.5 <0.04 <0.01 <0.045 <0.009 <0.0004

Performance:
1. High purity, small particle size distribution, large specific surface area, high surface activity, low bulk density, good performance of injection molding; 2. For composite materials, and good match with the semiconductor silicon, interface compatibility, and can improve the mechanical properties of composite materials and the thermal conductivity of dielectric.
Application: 
Manufacturing integrated circuit board, electronic devices, optical devices, radiator, high temperature crucible; Fabrication of metal matrix and polymer matrix composites, especially in the heat seal adhesives and electronic packaging materials have wide application; High thermally conductive ceramics; Composite ceramics, e.g. evaporation boats; Heat sinks; Electrically insulating packages for electronics; Crucibles for metals and salt melts; Thermally conductive filler for polymers; Components for wafer processing ( chucks, carriers), etc.


Aluminum Nitride Powder (AlN, hexagonal) 500/800nm
AlN Purity: 99.5%
AlN APS: 800nm & 500nm
AlN Color: gray
AlN Zeta Potential: 44.7mV
AlN Making Method: Physical methods.
Thermal conductivity value 320w/mk
Thermal expansion coefficient: 3.5 × 10-6K-1

 
Aluminum Nitride Powder (AlN) Certificate of Analysis--%
N O C Fe Si Ca Cl
>33 <0.5 <0.04 <0.01 <0.045 <0.009 <0.0004


Applications: 
Manufacturing integrated circuit board, electronic devices, optical devices, radiator, high temperature crucible; Fabrication of metal matrix and polymer matrix composites, especially in the heat seal adhesives and electronic packaging materials have wide application; High thermally conductive ceramics; Composite ceramics, e.g. evaporation boats; Heat sinks; Electrically insulating packages for electronics; Crucibles for metals and salt melts; Thermally conductive filler for polymers; Components for wafer processing ( chucks, carriers),etc.

Inquiry

Product:
Name:
Email:
Country:
Content: