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wafer butterfly valve

Tin-Copper Alloy Sn-Cu Powder

Tin-Copper Alloy Sn-Cu Powder

Tin-Copper Alloy Sn-Cu Powder

Detailed

Proportion: SN:CU/1:9, SN:CU/1:9,Sn:Cu/9:1, SN:CU/92:8
Purity: 99.9%
APS: 40nm-100nm

Nano Alloy SN:CU/1:9 - COA

As

Sb

Pb

Bi

Fe

≤0.002

≤0.002

≤0.001

≤0.003

≤0.006

Storage Conditions:
Damp reunion will affect its dispersion performance and using effects, therefore, this product should be sealed in vacuum and stored in cool and dry room and it should not be exposure to air. In addition, the product should be avoided under stress.

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