Products

Nano Materials

Micro Material

Lubricating Material

Rare Earth Material

Insulation

Non-ferrous Metal

Water purification material

Bio Products

Environmental Material

Common Chemical

Wear Resistant

Dispersion

Telluride

wafer butterfly valve

Hexagonal Aluminum Nitride Nanopowder AlN powder

Hexagonal Aluminum Nitride Nanopowder AlN powder

Hexagonal Aluminum Nitride Nanopowder AlN powder

Detailed
Aluminum Nitride Nanopowder (AlN, hexagonal) 65-75nm
Purity: 99.5%
APS: 65-75 nm
SSA: 40-80 m2/g
Color: gray
Zeta Potential: 44.7mV
Bulk Density: 0.05g/cm3
Thermal conductivity value 320w/mk
Thermal expansion coefficient: 3.5 × 10-6K-1

Aluminum Nitride Nanoparticles (AlN) Certificate of Analysis--%
N O C Fe Si Ca Cl
>33 <0.5 <0.04 <0.01 <0.045 <0.009 <0.0004

Performance:
1. High purity, small particle size distribution, large specific surface area, high surface activity, low bulk density, good performance of injection molding; 2. For composite materials, and good match with the semiconductor silicon, interface compatibility, and can improve the mechanical properties of composite materials and the thermal conductivity of dielectric.
Application: 
Manufacturing integrated circuit board, electronic devices, optical devices, radiator, high temperature crucible; Fabrication of metal matrix and polymer matrix composites, especially in the heat seal adhesives and electronic packaging materials have wide application; High thermally conductive ceramics; Composite ceramics, e.g. evaporation boats; Heat sinks; Electrically insulating packages for electronics; Crucibles for metals and salt melts; Thermally conductive filler for polymers; Components for wafer processing ( chucks, carriers), etc.


Aluminum Nitride Powder (AlN, hexagonal) 500/800nm
AlN Purity: 99.5%
AlN APS: 800nm & 500nm
AlN Color: gray
AlN Zeta Potential: 44.7mV
AlN Making Method: Physical methods.
Thermal conductivity value 320w/mk
Thermal expansion coefficient: 3.5 × 10-6K-1

 
Aluminum Nitride Powder (AlN) Certificate of Analysis--%
N O C Fe Si Ca Cl
>33 <0.5 <0.04 <0.01 <0.045 <0.009 <0.0004


Applications: 
Manufacturing integrated circuit board, electronic devices, optical devices, radiator, high temperature crucible; Fabrication of metal matrix and polymer matrix composites, especially in the heat seal adhesives and electronic packaging materials have wide application; High thermally conductive ceramics; Composite ceramics, e.g. evaporation boats; Heat sinks; Electrically insulating packages for electronics; Crucibles for metals and salt melts; Thermally conductive filler for polymers; Components for wafer processing ( chucks, carriers),etc.

Inquiry

Product:
Name:
Email:
Country:
Content: