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Titanium Nitride TiN 20/80/800nm 99.2% Cubic

Titanium Nitride TiN 20/80/800nm 99.2% Cubic

Titanium Nitride TiN 20/80/800nm 99.2% Cubic

Detailed
Titanium Nitride Nanopowder (TiN) 20nm
Color: Black
Crystal Phase: Cubic
APS: 20nm
SSA: 50-80m2/g
Zeta Potential: -17.5mV
Bulk Density: 0.08g/cm3
True Density: 5.22g/cm3 
Melting Point: 2950 °C
CAS No.: 25583-20-4

Titanium Nitride Nanopowder (TiN) 80nm
Color: Black
Crystal Phase: Cubic
Purity: >99.2%
APS: 80nm
SSA: 30-50m2/g
Zeta Potential: -17.5mV
Bulk Density: 0.15 g/cm3
True Density: 5.22g/cm3 
Melting Point: 2950 °C
CAS : 25583-20-4


Titanium Nitride Nanopowder (TiN) 800nm
Color: Black
Crystal Phase: Cubic
Purity: >99.2%
APS: 80nm
SSA: 30-50m2/g
Zeta Potential: -17.5mV
Bulk Density: 0.15 g/cm3
True Density: 5.22g/cm3 
Melting Point: 2950 °C
CAS: 25583-20-4
 
 

Titanium Nitride Nanopowder (TiN) Certificate of Analysis--ppm

Ti

N

C

Fe

Ni

Si

77.87%

21.88%

2ppm

15ppm

5ppm

18ppm

*Flammable
 
Features:
The nano-titanium nitride has a high melting point (2950 °C), high hardness, high-temperature chemical stability and excellent thermal conductivity properties. Also, it possesses high performance infrared absorption and UV-shielding more than 80%. Its sintering temperature is low. Nano-titanium nitride (TiN) is an excellent ceramic material.

Applications:
Mainly used for Modified macromolecule polymers and some functional energy saving films. Artificial limbs; Barrier layer in contact and interconnect metallization; Biological materials cutting tools; Gate electrode in metal-oxide-semiconductor (MOS) transistors; Low-barrier Schottky diode; Optical devices in aggressive environments; Plastic molds; Prostheses; Wear-resistant coating. 

Storage Conditions:
Damp reunion will affect its dispersion performance and using effects, therefore, this product should be sealed in vacuum and stored in cool and dry room and it should not be exposure to air. In addition, the product should be avoided under stress.

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